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Carpet-Burns on : HTC Care

Machining and Moulding
Most woodworking tools can be used on HTC provided they are kept sharp. The biggest problem is frictional heat, which causes the plastic material, especially swarf, to melt the general rule is, 'fast speed, slow feed', and if necessary use water based cutting fluids.
Take care when handling HTC sheets as they will scratch easily if handled roughly be especially aware when stacking. Some edges may be sharp and gloves should be worn when moving material

Drilling
HTC will drill quite easily, Drills should be kept sharp, and the drill regularly withdrawn to ensure that melting is not taking place at the point - the 'woodpecker' method.

Milling and Routing
Milling machines and woodworking routers can be successfully used on HTC boards remember to use sharp tools and a relatively slow feed rate and clamp the material down properly.

Sawing
It is recommended that a 96 toothed blade is used, however most saws can be used if using a jig saws be extra cautious as these can generate heat, attention should be given to swarf removal and blade cooling,. It is difficult to achieve fine finishes with sawing and finishing is often necessary through running a small flame over the untidy edge

Fastening
Most types of fastenings can be used including screws, clips, rivets and bolts, especially those recommended for MDF boards

Surface Finishing
HTC boards are supplied with a gloss or matt finish. HTC will scratch easily, however these can be carefully sanded out with a fine grade of paper or buffed up with car polish

Maintenance
Surface dirt can be easily removed using a mild detergent and warm water.

Resistance
HTC sheets must not be exposed to excessive heat as this will melt and eventually burn the material. They will withstand hot water, but prolonged application of boiling water will soften the sheet and cause it to lose try to keep the material out of direct sunlight.

Safety Data Sheet

Physical Data and handling  
Physical form Solid in sheet form
Odour Weak
Melting Point 100-170°C
Boiling Point not applicable
Density not applicable
Solubility in Water Insoluble